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CC2564MODA图片
 产品型号:CC2564MODA
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 详细介绍

CC2564MODA_CC2564MODx Bluetooth 主机控制器接

 

描述

 

The TI CC2564MODx module is a complete Bluetooth BR/EDR/LE HCI solution based on TI’s CC2564B dual-mode Bluetooth single-chip device, which reduces design effort and enables fast time to market. The CC2564MODx module includes TI’s seventh-generation core and provides a product-proven solution that is Bluetooth 4.1 compliant. The CC2564MODx module provides best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions. Furthermore, TI’s power management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod®(MFi) protocol is supported by add-on software packages. For more inion, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several LE profiles and services

In addition to software, the CC2564MODxEM evaluation board is available for each variant. For more inion on TI’s wireless platform solutions for Bluetooth, see TI’s CC256x wiki.

 

特性

 

  • Module Solution Based on TI’s CC2564B Dual- 
    Mode Bluetooth Single Chip With Bluetooth Basic 
    Rate (BR), Enhanced Data Rate (EDR) and Low 
    Energy (LE) Support; Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Bluetooth 4.1 Module
    • FCC (Z64-2564N)/IC (451I-2564N) Modular 
      Grant (see Section 6.2.1.3, Antenna
      Section 7.1.1, FCC Certification, and 
      Section 7.1.2, IC Certification)
    • CE Certified as Summarized in the Declaration 
      of Conformity (see Section 7.1.3, ETSI/CE 
      Certification
      )
    • Bluetooth 4.1 Controller Subsystem Qualified 
      (CC2564MODN: QDID 55257; CC2564MODA: 
      QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form 
    Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm 
        Pitch, 7 mm × 14 mm × 1.4 mm (Typ)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm 
        Pitch, 7 mm × 7 mm × 1.4 mm (Typ)
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1 
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously 
      Variable Slope Delta (CVSD), A-Law, µ-Law, 
      and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech 
      (WBS) Profile or A2DP Profile to Reduce Host 
      Processing and Power
    • Support of Multiple Profiles With 
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to 
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large 
      Numbers of Multiple Connections Without 
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling 
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance 
    (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power Up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and 
      Compensation to Ensure Minimal Variation in 
      RF Performance Over Temperature, No 
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) 
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range 
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended 
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct 
      Connection to Battery
    • Low Power Consumption for Active, Standby, and ScanBluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power 
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum 
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum 
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With 
        Maximum Rate of 4 Mbps
    • Fully Programmable Digital PCM-I2S Codec 
      Interface
  • Flexibility for Easy Stack Integration and Validation 
    Into Various Microcontrollers, Such as MSP430™ 
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC- 
    Based Application to Evaluate RF Performance of the 
    Device and Configure Service Pack
  • Lead-Free Design Compliant With RoHS 
    Requirements

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